Optical apparatus

ABSTRACT

An optical apparatus includes a substrate  1 , a wiring pattern  8  formed on the substrate  1 , a light-receiving element  3  and a light-emitting element  2  provided on the substrate  1  and spaced apart from each other in a direction x, a light-transmitting resin  4  covering the light-receiving element  3 , a light-transmitting resin  5  covering the light-emitting element  2 , and a light-shielding resin  6  covering the light-transmitting resin  4  and the light-transmitting resin  5 . The wiring pattern  8  includes a first light-blocking portion  83  interposed between the light-shielding resin  6  and the substrate  1  and positioned between the light-receiving element  3  and the light-emitting element  2  as viewed in x-y plane. The first light-blocking portion  83  extends across the light-emitting element  2  as viewed in the direction x.

This application is a Continuation of U.S. Ser. No. 13/980,446, filedJul. 18, 2013, which is a National Stage Application ofPCT/JP2012/050460, filed Jan. 12, 2012, which applications areincorporated herein by reference.

TECHNICAL FIELD

The present invention relates to an optical apparatus.

BACKGROUND ART

FIG. 38 is a sectional view of an example of a proximity sensor. Theproximity sensor 900 shown in the figure includes a glass-epoxysubstrate 91, alight-emitting element 92, a light-receiving element 93,primary mold resin portions 94, 95, and a secondary mold resin portion96. The light-emitting element 92 and the light-receiving element 93 aremounted on the glass-epoxy substrate 91. The light-emitting element 92emits infrared light. The light-receiving element 93 sends out anelectric signal corresponding to the amount of received infrared light.The primary mold resin portions 94 and 95 are transparent and transmitinfrared light. The primary mold resin portion 94 covers thelight-receiving element 93 on the glass-epoxy substrate 91. The primarymold resin portion 94 has a convex light-incident surface 940. Theprimary mold resin portion 95 covers the light-emitting element 92 onthe glass-epoxy substrate 91. The primary mold resin portion 95 has aconvex light-emitting surface 950. The secondary mold resin portion 96is black and does not transmit infrared light. The secondary mold resinportion 96 covers the primary molding resin portions 94 and 95 on theglass-epoxy substrate 91. The secondary mold resin portion 96 has afirst opening 961 and a second opening 962. The light-incident surface940 is exposed to the direction z side through the first opening 961.The light-emitting surface 950 is exposed to the direction z sidethrough the second opening 962. The highest point of the light-incidentsurface 940 is at the same position as the edge of the first opening 961in the direction z. Similarly, the highest point of the light-emittingsurface 950 is at the same position as the edge of the second opening962 in the direction z. This type of proximity sensor is disclosed ine.g. Patent Document 1.

For instance, the proximity sensor 900 is incorporated in a touch paneltype electronic device (such as a cell phone). The proximity sensor 900is arranged adjacent to a liquid crystal display 902 of an electronicdevice. The proximity sensor 900 and the liquid crystal display 902 facea light-transmitting cover 903. The infrared light L91 emitted from thelight-emitting element 92 travels through the light-emitting surface 950toward the light-transmitting cover 903. The infrared light L91 thenpasses through the light-transmitting cover 903 to be reflected by theobject 901. The infrared light L91 reflected by the object 901 passesthrough the light-transmitting cover 903 again. Then, the infrared lightL91 passes through the light-incident surface 940 to be received by thelight-receiving element 93. The light-receiving element 93 sends anelectric signal corresponding to the amount of the received infraredlight to a controller (not shown). When the output level from thelight-receiving element 93 exceeds a predetermined threshold, thecontroller determines that the object 901 is close to the liquid crystaldisplay 902. That is, in an electronic device, when a user holds aliquid crystal display 902 close to his or her cheek to make a phonecall, the approach of the cheek is detected by the proximity sensor 900.By this, the touch panel operation using the liquid crystal display 902is disabled during a phone call, whereby malfunction during a phone callis prevented. Also, during a phone call, the liquid crystal display 902is set to an “off” state, which suppresses power consumption of thebattery of the electronic device.

As shown in FIG. 38, the proximity sensor 900 is arranged to have acertain distance from the light-transmitting cover 903. Thus, some partof the infrared light emitted from the light-emitting surface 950impinges on the light-transmitting cover 903 with a relatively largeincident angle. The light impinging on the light-transmitting cover 903with a relatively large incident angle is reflected by thelight-transmitting cover 903 to become noise light L92. The noise lightL92 impinging on the light-incident surface 940 can be received by thelight-receiving element 93. When the noise light L92 is received by thelight-receiving element 93, false detection may occur in which thecontroller determines the object 901 is close to the light-transmittingcover 903, though the object 901 is not actually close to thelight-transmitting cover.

The proximity sensor 900 may include an illuminance sensor, in additionto the light-receiving element 93. Each of the illuminance sensor andthe light-receiving element 93 is made of a chip and arranged on theglass-epoxy substrate 91. In recent years, there is an increasing demandfor size reduction of such a proximity sensor 900.

In the proximity sensor 900, between the primary mold resin portion 94and the primary mold resin portion 95, the same transparent resin as thematerial for the primary mold resin portions 94, 95 may be formed in thespace between the secondary mold resin portion 96 and the glass-epoxysubstrate 91. In this case, during the use of the proximity sensor 900,the light emitted from the light-emitting element 92 may pass throughthis transparent resin to be received by the light-receiving element 93.The above-described false detection may occur when the light emittedfrom the light-emitting element 92 passes through this transparent resinand received by the light-receiving element 93.

TECHNICAL REFERENCE Patent Document

Patent Document 1: JP-A-2010-34189

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

The present invention has been conceived under the circumstancesdescribed above. It is therefore an object of the present invention toprovide an optical apparatus that does not easily cause false detection.

Means for Solving the Problems

According to a first aspect of the present invention, there is providedan optical apparatus comprising a substrate, a wiring pattern on thesubstrate, a light-receiving element and a light-emitting elementprovided on the substrate and spaced apart from each other in a firstdirection perpendicular to a thickness direction of the substrate, afirst light-transmitting resin covering the light-receiving element, asecond light-transmitting resin covering the light-emitting element, anda light-shielding resin covering the first light-transmitting resin andthe second light-transmitting resin. The wiring pattern includes a firstlight-blocking portion interposed between the light-shielding resin andthe substrate and positioned between the light-receiving element and thelight-emitting element as viewed in the thickness direction. The firstlight-blocking portion extends across the light-emitting element asviewed in the first direction.

According to a second aspect of the present invention, there is providedan optical apparatus comprising a substrate, a light-receiving elementprovided on the substrate, a first light-transmitting resin covering thelight-receiving element, and a light-shielding resin covering the firstlight-transmitting resin and including a first opening. The firstlight-transmitting resin includes a light-incident surface exposedthrough the first opening. The light-shielding resin includes a firstirregular surface. In the depth direction of the first opening, thefirst irregular surface is oriented in the direction from thelight-receiving element toward the light-incident surface. The firstirregular surface is positioned on a first direction side of the firstopening, the first direction being perpendicular to the depth directionof the first opening.

According to a third aspect of the present invention, there is providedan optical apparatus comprising a substrate, a light-receiving elementprovided on the substrate, a first light-transmitting resin covering thelight-receiving element, and a light-shielding resin covering the firstlight-transmitting resin and including a first opening. The firstlight-transmitting resin includes a light-incident surface exposedthrough the first opening. The light-receiving element includes asemiconductor substrate, an infrared light detecting portion provided onthe semiconductor substrate, and a visible light detecting portionprovided on the semiconductor substrate.

According to a fourth aspect of the present invention, there is providedan optical apparatus comprising a substrate, a light-receiving elementprovided on the substrate, a first light-transmitting resin covering thelight-receiving element, and a light-shielding resin covering the firstlight-transmitting resin and including a first opening. The firstlight-transmitting resin includes a light-incident surface exposedthrough the first opening. The light-shielding resin includes a firstinner circumferential wall defining the first opening. The first innercircumferential wall includes a first edge. In the depth direction ofthe first opening, the first edge is offset in the direction from thelight-receiving element toward the light-incident surface from anyportion of the first light-transmitting resin exposed through the firstopening.

Preferably, the first light-blocking portion includes a first portionand a second portion spaced apart from each other, and thelight-shielding resin includes a bonding portion that is sandwichedbetween the first portion and the second portion and in contact with thesubstrate.

Preferably, the bonding portion overlaps the light-emitting element in asecond direction perpendicular to both of the thickness direction of thesubstrate and the first direction.

Preferably, each of the first portion and the second portion is in theform of a strip elongated in a second direction perpendicular to both ofthe thickness direction of the substrate and the first direction.

Preferably, the first light-blocking portion includes two joint portionsspaced apart from each other as viewed in the thickness direction, withthe bonding portion positioned therebetween. Each of the joint portionsis connected to both of the first portion and the second portion.

Preferably, the wiring pattern includes a light-emitting element pad onwhich the light-emitting element is bonded.

Preferably, the wiring pattern includes a second light-blocking portioninterposed between the light-shielding resin and the substrate. Thesecond light-blocking portion overlaps the light-emitting element pad inthe first direction.

Preferably, the second light-blocking portion includes a portion coveredby the second light-transmitting resin.

Preferably, the second light-blocking portion is connected to the firstlight-blocking portion.

Preferably, the wiring pattern includes a third light-blocking portioninterposed between the light-shielding resin and the substrate. Thethird light-blocking portion overlaps the light-emitting element pad inthe first direction. The light-emitting element pad is positionedbetween the second light-blocking portion and the third light-blockingportion as viewed in the first direction.

Preferably, the third light-blocking portion includes a portion coveredby the second light-transmitting resin.

Preferably, the third light-blocking portion is connected to the firstlight-blocking portion.

Preferably, the optical apparatus further comprises a wire bonded to thelight-emitting element. The wiring pattern includes a wire bonding padon which the wire is bonded. The third light-blocking portion iselectrically connected to the wire bonding pad.

Preferably, the optical apparatus further comprises a wire bonded to thelight-emitting element. The wiring pattern includes a wire bonding padon which the wire is bonded, and a linking portion connected to thelight-emitting element pad and the first light-blocking portion.

Preferably, the light-emitting element includes a cathode electrode andan anode electrode. The first light-blocking portion is electricallyconnected to the cathode electrode.

Preferably, the first light-blocking portion is a ground electrode.

Preferably, the wiring pattern includes a light-receiving element pad onwhich the light-receiving element is arranged, and a connecting portionconnected to the light-receiving element pad and the firstlight-blocking portion.

Preferably, the first light-blocking portion includes a portion coveredby the second light-transmitting resin.

Preferably, the wiring pattern includes a mounting terminal on a side ofthe substrate which is opposite from a side where the firstlight-blocking portion is provided.

Preferably, the optical apparatus further comprises a through-holeelectrode electrically connected to the mounting terminal andpenetrating the substrate.

Preferably, in the first irregular surface, the light-shielding resinincludes a plurality of grooves extending in one direction.

Preferably, the first irregular surface includes first groove surfacesand second groove surfaces. Each of the first groove surfaces and eachof the second groove surfaces define one of the grooves and face eachother across the bottom of the groove. The second groove surface isfurther away from the first opening than the first groove surface is.

Preferably, the first groove surface is inclined at a first angle withrespect to the first direction, and the second groove surface ininclined at a second angle smaller than the first angle with respect tothe first direction.

Preferably, the first angle is 50-70°.

Preferably, each of the grooves extends in a second directionperpendicular to both of the depth direction and the first direction.

Preferably, each of the grooves extends circumferentially around thecenter of the first opening.

Preferably, each of the grooves extends in the first direction. Thefirst irregular surface includes first groove surfaces and second groovesurfaces. Each of the first groove surfaces and each of the secondgroove surfaces define one of the grooves and face each other across thebottom of the groove. The first groove surfaces are inclined at a firstangle with respect to a second direction perpendicular to both of thedepth direction and the first direction. The second groove surfaces arefurther away from an imaginary straight line extending through thecenter of the first opening in the first direction than the first groovesurfaces are and inclined at a second angle smaller than the first anglewith respect to the second direction.

Preferably, the light-shielding resin includes a second irregularsurface oriented in the direction from the light-receiving elementtoward the light-incident surface in the depth direction of the firstopening. The first opening is positioned between the first irregularsurface and the second irregular surface.

Preferably, both of the first groove surfaces and the second groovesurfaces are flat.

Preferably, the light-incident surface includes a portion that overlapsthe infrared light detecting portion as viewed in the depth direction ofthe first opening.

Preferably, the light-receiving element includes a multi-layered opticalfilm that covers the infrared light detecting portion and transmitsinfrared light.

Preferably, part of the visible light detecting portion is positionedinside a smallest rectangular region that is the smallest rectangularregion enclosing the infrared light detecting portion as viewed in thedepth direction of the first opening.

Preferably, the entirety of the visible light detecting portion ispositioned outside a smallest rectangular region that is the smallestrectangular region enclosing the infrared light detecting portion asviewed in the depth direction of the first opening.

Preferably, the light-receiving element includes a functional elementportion that performs computation with respect to an output from thevisible light detecting portion and an output from the infrared lightdetecting portion.

Preferably, the light-receiving element includes a multi-layered opticalfilm that covers the infrared light detecting portion and the functionalelement portion and transmits infrared light.

Preferably, the optical apparatus further includes a light-emittingelement provided on the substrate. As viewed in the depth direction ofthe first opening, the infrared light detecting portion is further awayfrom the light-emitting element than the visible light detecting portionis.

Preferably, the first inner circumferential wall is an inclined surfacethat proceeds toward the center of the first opening as proceedingtoward the deeper side in the depth direction of the first opening.

Preferably, the first inner circumferential wall includes a firstportion and a second portion facing each other in a first directionperpendicular to the depth direction of the first opening. Theinclination angle of the first portion with respect to the depthdirection of the first opening is larger than the inclination angle ofthe second portion with respect to the depth direction of the firstopening.

Preferably, the inclination angle of the first portion with respect tothe depth direction of the first opening is not less than 15°.

Preferably, the first light-transmitting resin includes a firstprojection received in the first opening, and the first projectionprovides the light-incident surface.

Preferably, the first projection is spaced apart from the first innercircumferential wall.

Preferably, the light-incident surface is flat.

Preferably, the optical apparatus further includes a light-emittingelement provided on the base, and a second light-transmitting resincovering the light-emitting element. The light-shielding resin isinterposed between the first light-transmitting resin and the secondlight-transmitting resin and covers the second light-transmitting resin.The light-shielding resin includes a second opening, and the secondlight-transmitting resin includes a light-emitting surface exposedthrough the second opening.

Preferably, the light-shielding resin includes a second innercircumferential wall defining the second opening. The second innercircumferential wall includes a second edge. In the depth direction ofthe second opening, the second edge is offset in the direction from thelight-emitting element toward the light-emitting surface from anyportion of the second light-transmitting resin exposed through thesecond opening.

Preferably, the second inner circumferential wall is an inclined surfacethat proceeds toward the center of the second opening as proceedingtoward the deeper side in the depth direction of the second opening.

Preferably, the second light-transmitting resin includes a secondprojection received in the second opening, and the second projectionprovides the light-emitting surface.

Preferably, the second light-transmitting resin includes a first cutsurface provided by the second projection, and a second cut surfaceprovided by the second projection and positioned further away from thelight-receiving element than the first cut surface is.

Preferably, the first cut surface faces the second inner circumferentialwall. The second cut surface is exposed from the light-shielding resinto the side opposite from the side where the light-receiving element isarranged.

Preferably, the first cut surface is spaced apart from the second innercircumferential wall.

Preferably, the light emitting-surface is a convex surface.

According to a fifth aspect of the present invention, there is providedan electronic device comprising an optical apparatus provided by any oneof the first through the fourth aspects of the present invention, and alight-transmitting cover facing the light-emitting surface.

Other features and advantages of the present invention will become moreapparent from detailed description given below with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an optical apparatus according to afirst embodiment;

FIG. 2 is a sectional view taken along lines II-II in FIG. 1;

FIG. 3 is a sectional view taken along lines III-III in FIG. 1;

FIG. 4 is a sectional view taken along lines IV-IV in FIG. 1;

FIG. 5 is a plan view of the optical apparatus shown in FIG. 1;

FIG. 6 is a sectional view taken along lines VI-VI in FIG. 5;

FIG. 7 is a sectional view taken along lines VII-VII in FIG. 5;

FIG. 8 is a plan view of a light-receiving element of the opticalapparatus shown in FIG. 1;

FIG. 9A is an equivalent circuit diagram schematically showing a visiblelight detecting portion of the light-receiving element shown in FIG. 8;

FIG. 9B is an equivalent circuit diagram schematically showing aninfrared light detecting portion of the light-receiving element shown inFIG. 8;

FIG. 10 is a plan view showing the state when the two light-transmittingresins and the light-shielding resin are omitted from FIG. 5;

FIG. 11 is a bottom view of the optical apparatus according to the firstembodiment;

FIG. 12 is a schematic enlarged sectional view taken along lines XII-XIIin FIG. 10;

FIG. 13 a schematic enlarged sectional view taken along lines XIII-XIIIin FIG. 10;

FIG. 14 is a plan view showing a step in a process of making the opticalapparatus according to the first embodiment;

FIG. 15 is a plan view showing a step subsequent to FIG. 14;

FIG. 16 is a schematic enlarged sectional view taken along lines XVI-XVIin FIG. 15;

FIG. 17 is a schematic enlarged sectional view taken along linesXVII-XVII in FIG. 15;

FIG. 18 is a plan view showing a step subsequent to FIG. 15;

FIG. 19 is a schematic enlarged sectional view taken along lines XIX-XIXin FIG. 18;

FIG. 20 is a schematic enlarged sectional view taken along lines XX-XXin FIG. 18;

FIG. 21 is a sectional view showing a step in a process of making theoptical apparatus according to the first embodiment;

FIG. 22 is a sectional view of an electronic device according to thefirst embodiment;

FIG. 23 is a sectional view of an electronic device according to thefirst embodiment;

FIG. 24 is a graph for explaining noise light reduction effect;

FIG. 25 is a graph for explaining noise light reduction effect;

FIG. 26 is a plan view showing a variation of the optical deviceaccording to the first embodiment;

FIG. 27 is a sectional view of an optical apparatus according to asecond embodiment;

FIG. 28 is a sectional view of an optical apparatus according to a thirdembodiment;

FIG. 29 is a plan view of an optical apparatus according to a fourthembodiment;

FIG. 30 is a sectional view taken along lines XXX-XXX in FIG. 29;

FIG. 31 is a plan view of an optical apparatus according to a fifthembodiment;

FIG. 32 is a sectional view taken along lines XXXII-XXXII in FIG. 31;

FIG. 33 is a perspective view of an optical apparatus according to asixth embodiment;

FIG. 34 is a sectional view taken along lines XXIV-XXIV in FIG. 33;

FIG. 35 is a plan view showing a light-receiving element of an opticalapparatus according to a seventh embodiment;

FIG. 36 is a sectional view of an optical apparatus according to aneighth embodiment;

FIG. 37 is a sectional view of an electronic device according to a ninthembodiment; and

FIG. 38 is a sectional view showing a proximity sensor of related art.

MODE FOR CARRYING OUT THE INVENTION

<First Embodiment>

A first embodiment is described below with reference to FIGS. 1-25. Theelectronic device 801 shown in FIG. 22 includes an optical apparatus101, a liquid crystal display 802 and a light-transmitting cover 803.For instance, the electronic device 801 is a cell phone of a touch paneltype.

The liquid crystal display 802 displays icons used for carrying outvarious functions of the electronic device 801. For instance, thelight-transmitting cover 803 is made of acrylic. The light-transmittingcover 803 transmits infrared light and visible light. Thelight-transmitting cover 803 faces the liquid crystal display 802 andthe optical apparatus 101. The optical apparatus 101 is arranged asspaced apart from the light-transmitting cover 803 a distance d. Forinstance, the distance d is about 0.25-1 mm.

FIG. 1 is a perspective view of the optical apparatus 101 shown in FIG.22. FIG. 2 is a sectional view taken along lines II-II in FIG. 1. FIG. 3is a sectional view taken along lines in FIG. 1. FIG. 4 is a sectionalview taken along lines IV-IV in FIG. 1. FIG. 5 is a plan view of theoptical apparatus shown in FIG. 1. FIG. 6 is a sectional view takenalong lines VI-VI in FIG. 5. FIG. 7 is a sectional view taken alonglines VII-VII in FIG. 5.

The optical apparatus 101 shown in these figures is a proximity sensorand includes a substrate 1, a light-emitting element 2, alight-receiving element 3, light-transmitting resins 4, 5, alight-shielding resin 6, wires 78, 79 (see FIG. 2, not shown in FIGS. 3,4, 6, 7 and so on), and a wiring pattern 8 (see FIG. 2, not shown inFIGS. 3, 4, 6, 7 and so on).

For instance, the substrate 1 is made of glass epoxy resin. Thesubstrate 1 has a mount surface 10 and a back surface 11. The mountsurface 10 and the back surface 11 face away from each other. Both ofthe mount surface 10 and the back surface 11 have a length in thedirection x and a width in the direction y. The thickness direction ofthe substrate 1 corresponds to the direction z. A wiring pattern 8 isformed on the mount surface 10 and the back surface 11. The wiringpattern 8 is described later.

The light-emitting element 2 is an LED chip. The light-emitting element2 emits infrared light. The light-emitting element 2 is arranged on themount surface 10 of the substrate 1. The light-emitting element 2 iselectrically connected to the wiring pattern 8 on the mount surface 10via a wire 78. As viewed in x-y plane (viewed in the direction z), thelight-emitting element 2 is in the form of a rectangle having a size of0.35×0.35 mm. The light-emitting element 2 includes a cathode electrode21 and an anode electrode 22. In this embodiment, the anode electrode 22is bonded to the wiring pattern 8. To the cathode electrode 21 is bondedthe wire 78.

The light-receiving element 3 converts the received infrared light intoan electric signal corresponding to the received amount of infraredlight. The light-receiving element 3 is electrically connected to thewiring pattern 8 on the mount surface 10 via the wire 79. As viewed inx-y plane, the light-receiving element 3 is in the form of a rectanglehaving a size of 1.6×1.8 mm. Further, in this embodiment, thelight-receiving element 3 converts the received visible light into anelectric signal corresponding to the received amount of visible light.

FIG. 8 is a plan view of the light-receiving element 3 of the opticalapparatus 101 shown in FIG. 1. As shown in the figure, thelight-receiving element 3 includes a semiconductor substrate 30, avisible light detecting portion 31, an infrared light detecting portion32, a functional element portion 33 and a multi-layered optical film 34.

For instance, the semiconductor substrate 30 is a silicon substrate. Thevisible light detecting portion 31, the infrared light detecting portion32 and the functional element portion 33 are provided on thesemiconductor substrate 30. The visible light detecting portion 31 andthe infrared light detecting portion 32 are at the center of thesemiconductor substrate 30 as viewed in x-y plane. As shown in FIG. 8,in the light-receiving element 3, part of the visible light detectingportion 31 is positioned inside the smallest rectangular region S11enclosing the infrared light detecting portion 32 as viewed in x-yplane. In other words, the infrared light detecting portion 32 isL-shaped as viewed in x-y plane, and the visible light detecting portion31 makes an inroad into the infrared light detecting portion 32 (makesan inroad into a portion within the smallest rectangular region S11 andout of the infrared light detecting portion 32).

The functional element portion 33 is on the outer side of the visiblelight detecting portion 31 and the infrared light detecting portion 32.A plurality of wiring layers (now shown) are formed on the semiconductorsubstrate 30. Of the wiring layers of the semiconductor substrate 30,the portion overlapping the infrared light detecting portion 32 and thefunctional element portion 33 is covered by the multi-layered opticalfilm 34. The multi-layered optical film 34 has an opening in the portionoverlapping the visible light detecting portion 31. Thus, of the wiringlayers of the semiconductor substrate 30, the portion overlapping thevisible light detecting portion 31 is not covered by the multi-layeredoptical film 34 but exposed from the multi-layered optical film 34.

The visible light detecting portion 31 and the semiconductor substrate30 provide a plurality of photodiodes PDA1, PDA2, PDA3, PDB1, PDB2 andPDB3. Each of the photodiodes PDA1, PDA2 and PDA3 is formed by providinga pn junction surface (light-receiving surface) at a predetermined depthposition from the surface of the semiconductor substrate 30 in thethickness direction of the semiconductor substrate 30. Each of thephotodiodes PDA1, PDA2, PDA3 outputs a photocurrent corresponding to thereceived amount of visible light and infrared light by photoelectricconversion.

Each of the photodiodes PDB1, PDB2 and PDB3 is formed by providing a pnjunction surface (light-receiving surface) at a predetermined depthposition from the surface of the semiconductor substrate 30 in thethickness direction of the semiconductor substrate 30. The depthpositions of the photodiodes PDB1, PDB2, PDB3 from the surface of thesemiconductor substrate 30 are deeper than the depth positions of thephotodiodes PDA1, PDA2, PDA3 from the surface of the semiconductorsubstrate 30. It is known that the spectral sensitivity characteristicsof a photodiode generally depend on the depth of the pn junction surface(light-receiving surface) from the surface of the semiconductorsubstrate. As the position of the pn junction surface (light-receivingsurface) from the surface of the semiconductor substrate becomes deeper,the peak of the spectral sensitivity characteristics shifts toward alonger wavelength side. Thus, the spectral sensitivity characteristicsof the photodiodes PDB1, PDB2 and PDB3 are shifted toward a longerwavelength side as compared with the spectral sensitivitycharacteristics of the photodiodes PDA1, PDA2, PDA3. Therefore, each ofthe photodiodes PDB1, PDB2 and PDB3 outputs, by photoelectricconversion, a photocurrent corresponding to the received amount ofinfrared light only. The area of each photodiode PDB1, PDB2, PDB3 asviewed in x-y plane is smaller than that of each photodiode PDA1, PDA2,PDA3 as viewed in x-y plane.

FIG. 9A is an equivalent circuit diagram schematically showing thevisible light detecting portion 31 of the light-receiving element 3shown in FIG. 8. As shown in FIG. 9A, the photodiodes PDA1 and PDB1 forma pair to provide a first light-receiving unit 311. The photodiodes PDA1and PDB1 of the first light-receiving unit 311 are connected in seriesbetween the power supply potential Vcc and the ground potential. In thefirst light-receiving unit 311, current I1 is outputted from between thephotodiodes PDA1 and PDB1. The current I1 is the difference obtained bysubtracting the photocurrent from the photodiode PDB1, which contains aninfrared light component, from the photocurrent from the photodiodePDA1, which contains a visible light component and an infrared lightcomponent. That is, the first light-receiving unit 311 outputs thecurrent I1 corresponding to the difference between the amount of lightreceived by the photodiode PDA1 and the amount of light received by thephotodiode PDB1.

Similarly, the photodiodes PDA2 and PDB2 form a pair to provide a secondlight-receiving unit 312. The photodiodes PDA2 and PDB2 of the secondlight-receiving unit 312 are connected in series between the powersupply potential Vcc and the ground potential. The secondlight-receiving unit 312 outputs the current I2 corresponding to thedifference between the amount of light received by the photodiode PDA2and the amount of light received by the photodiode PDB2.

Similarly, the photodiodes PDA3 and PDB3 form a pair to provide a thirdlight-receiving unit 313. The photodiodes PDA3 and PDB3 of the thirdlight-receiving unit 313 are connected in series between the powersupply potential Vcc and the ground potential. The third light-receivingunit 313 outputs the current I3 corresponding to the difference betweenthe amount of light received by the photodiode PDA3 and the amount oflight received by the photodiode PDB3.

As shown in FIG. 8, the area ratio of the light-receiving surface of thephotodiode PDB1 to that of the photodiode PDA1 in the firstlight-receiving unit 311, the area ratio of the light-receiving surfaceof the photodiode PDB2 to that of the photodiode PDA2 in the secondlight-receiving unit 312, and the area ratio of the light-receivingsurface of the photodiode PDB3 to that of the photodiode PDA3 in thethird light-receiving unit 313 are different from each other. Though notdescribed in detail, the area ratios of the light-receiving surfaces aremade different from each other in order that a constant output can beobtained with respect to a given illuminance, regardless of the kind ofthe light source of the light that impinges on the visible lightdetecting portion 31. That is, in this embodiment, a constant output isobtained with respect to a given illuminance, regardless of whether thelight source is a halogen lamp that produces light containing a largeamount of infrared light component, an incandescent lamp that produceslight containing a still larger amount of infrared light component, or afluorescent lamp that produces light that does not contain a largeamount of infrared light component.

The semiconductor substrate 30 and the infrared light detecting portion32 provide a photodiode PDC. The photodiode PDC is formed by providing apn junction surface (light-receiving surface) at a predetermined depthposition from the surface of the semiconductor substrate 30 in thethickness direction of the semiconductor substrate 30. The depthposition of the photodiode PDC from the surface of the semiconductorsubstrate 30 is almost the same as the depth position of the photodiodesPDB1, PDB2, PDB3 from the surface of the semiconductor substrate 30.Therefore, the photodiode PDC outputs, by photoelectric conversion, aphotocurrent corresponding to the received amount of infrared lightonly. The area of the photodiode PDC as viewed in x-y plane is largerthan the entire area of the visible light detecting portion 31 as viewedin x-y plane. FIG. 9B is an equivalent circuit diagram schematicallyshowing the infrared light detecting portion 32 of the light-receivingelement 3 shown in FIG. 8. As shown in the figure, the photodiode PDC isconnected to the power supply potential Vcc. The photodiode PDC outputsa photocurrent Ic corresponding to the received amount of infraredlight.

The functional element portion 33 performs computation with respect toan output from the visible light detecting portion 31 and an output fromthe infrared light detecting portion 32. The functional element portion33 includes an analogue circuit and a digital circuit. The current I1from the first light-receiving unit 311, the current I2 from the secondlight-receiving unit 312, the current I3 from the third light-receivingunit 313, and the photocurrent Ic from the photodiode PDC are inputtedinto the functional element portion 33. Based on the photocurrent Ic,the functional element portion 33 computes, as a digital value, theamount of infrared light received by the photodiode PDC. When the amountof infrared light received by the photodiode PDC exceeds a predeterminedthreshold, a proximity signal indicating that there is an object nearbyis outputted to the outside. Further, based on the currents I1-I3, thefunctional element portion 33 computes, as a digital value, the amountof visible light received by the visible light detecting portion 31. Thefunctional element portion 33 outputs to the outside an illuminancesignal indicating the illuminance corresponding to the amount of visiblelight received by the visible light detecting portion 31.

The multi-layered optical film 34 is made of a resin that transmits onlythe light in the infrared wavelength range. As noted before, themulti-layered optical film 34 covers the infrared light detectingportion 32 and the functional element portion 33. Thus, the infraredlight detecting portion 32 and the functional element portion 33 doesnot receive visible light but receive infrared light only. Themulti-layered optical film 34 does not cover the visible light detectingportion 31. Thus, the visible light detecting portion 31 reliablyreceives visible light.

The light-transmitting resin 4 shown in FIGS. 1-3 and FIGS. 5-7 is afirst light-transmitting resin and covers the light-receiving element 3and the mount surface 10. The light-transmitting resin 4 is transparentand transmits light in the wavelength range from visible light toinfrared light. For instance, the light-transmitting resin 4 is made ofan epoxy resin. The light-transmitting resin 4 includes a flat surface43 and a projection 40.

The flat surface 43 is planar and extends along a plane perpendicular tothe direction z. The flat surface 43 is ring-shaped. The flat surface 43faces the direction z1 side. The projection 40 is a first projection andelevated from the flat surface 43 toward the direction z1 side. Asviewed in x-y plane, the outline of the projection 40 is in the form ofa circle that is e.g. 1 mm in diameter. As viewed in x-y plane, theprojection 40 is surrounded by the flat surface 43.

The projection 40 includes a light-incident surface 41. Thelight-incident surface 41 faces the direction z1 side. In thisembodiment, the light-incident surface 41 is planar and extends along aplane perpendicular to the direction z. Unlike this embodiment, thelight-incident surface 41 may be a convex surface bulging toward thedirection z1 side. As viewed in x-y plane, the light-incident surface 41overlaps the light-receiving element 3. More specifically, as viewed inx-y plane, the light-incident surface 41 overlaps the infrared lightdetecting portion 32 and the visible light detecting portion 31 of thelight-receiving element 3. The arrangement that the light-incidentsurface 41 overlaps the infrared light detecting portion 32 as viewed inx-y plane advantageously causes the light traveling in the direction z2to reliably reach the infrared light detecting portion 32. However,unlike this embodiment, as viewed in x-y plane, the light-incidentsurface 41 may not overlap the visible light detecting portion 31 andthe flat surface 43 may overlap the visible light detecting portion 31.

The light-transmitting resin 5 shown in FIGS. 1, 2, 4 and 5 is a secondlight-transmitting resin and covers the light-emitting element 2 and themount surface 10. The light-transmitting resin 5 is transparent andtransmits light in the wavelength range from visible light to infraredlight. For instance, the light-transmitting resin 5 is made of an epoxyresin. The light-transmitting resin 5 includes a flat surface 53 and aprojection 50.

The flat surface 53 is planar and extends along a plane perpendicular tothe direction z. The flat surface 53 faces the direction z1 side. Theprojection 50 is a second projection and elevated from the flat surface53 toward the direction z1 side. As viewed in x-y plane, the projection50 is surrounded by the flat surface 53.

The projection 50 includes a light-emitting surface 51 and a pair of cutsurfaces 52A and 52B. The light-emitting surface 51 faces the directionz1 side. The light-emitting surface 51 is a convex surface bulgingtoward the direction z1 side. The light-emitting surface 51 is madeconvex toward the direction z1 side in order that a large amount oflight from the light-emitting element 2 travels toward the direction z1side. As viewed in x-y plane, the light-emitting surface 51 overlaps thelight-emitting element 2. The light-emitting surface 51 has an edgewhich is arcuate as viewed in x-y plane at each of its two ends spacedapart from each other in the direction y. The maximum diameter of thelight-emitting surface 51, which is the distance between these twoedges, is e.g. 0.44 mm. Each cut surface 52A, 52B is planar and extendsalong the y-z plane. The cut surface 52A faces the direction x2 side,whereas the cut surface 52B faces the direction x1 side. Each of the cutsurfaces 52A and 52B is connected to the light-emitting surface 51 at anend in the direction x. As shown in FIG. 5, the distance between the cutsurface 52A and the light-receiving element 3 is smaller than thedistance between the cut surface 52B and the light-receiving element 3.That is, the cut surface 52B is positioned further away from thelight-receiving element 3 than the cut surface 52A is.

As shown in FIG. 2, the light-shielding resin 6 covers thelight-transmitting resins 4, 5 and the mount surface 10. Thelight-shielding resin 6 transmits neither visible light nor infraredlight. For instance, the light-shielding resin 6 is made of an epoxyresin. The light-shielding resin 6 is positioned between thelight-transmitting resin 4 and the light-transmitting resin 5. Betweenthe light-transmitting resin 4 and the light-transmitting resin 5, thelight-shielding resin 6 is indirect contact with the mount surface 10throughout the entire dimension of the mount surface 10 in the directiony. With this arrangement, infrared light emitted from the light-emittingelement 2 is prevented from directly reaching the light-receivingelement 3 by passing through the inside of the optical apparatus 101.

As shown in FIGS. 1 and 5, the light-shielding resin 6 includes a firstsurface 6A, a pair of second surfaces 6B and 6C, and a pair of thirdsurfaces 6D and 6E.

The first surface 6A faces the direction z1 side. For instance, thefirst surface 6A is 5 mm in length along the direction x and 2.5 mm inwidth along the direction y. As shown in FIGS. 1 and 2, the firstsurface 6A includes a surface 601 (second irregular surface), a surface602, a surface 603 (first irregular surface) and a surface 604. In thisembodiment, the surfaces 601-604 have the same sectional shape. Detaileddescription is given below.

As shown in FIGS. 1 and 2, the surface 601 of the first surface 6A is aportion that is on the direction x2 side of the first opening 61, whichwill be described later. At the surface 601, the light-shielding resin 6has a plurality of grooves 641 (not shown in FIG. 5). The grooves 641extend in one direction. In this embodiment, the grooves 641 extend inthe direction y. The surface 601 includes first groove surfaces 651 aand second groove surfaces 651 b. Each of the first groove surfaces andeach of the second groove surfaces define one of the grooves 641 andface each other across the bottom of the groove. In each of the grooves641, the first groove surface 651 a is on the direction x2 side, whereasthe second groove surface 651 b is on the direction x1 side. That is, ineach of the grooves 641, the first groove surface 651 a is further awayfrom the first opening 61 than the second groove surface 651 b is. Bothof the first groove surface 651 a and the second groove surface 651 bextend along the direction y and are planar.

Each first groove surface 651 a is an inclined surface that proceedstoward the direction z2 side as proceeding toward the direction x1 side.The first groove surface 651 a is inclined at a first angle θ11 withrespect to the direction x. Each second groove surface 651 b is aninclined surface that proceeds toward the direction z2 side asproceeding toward the direction x2 side. The second groove surface 651 bis inclined at a second angle θ12 with respect to the direction x.Preferably, each of the first angle θ11 and the second angle θ12 is50-70°. In this embodiment, the first angle θ11 and the second angle θ12are the same.

As shown in FIGS. 1 and 2, the surface 602 of the first surface 6A is aportion that overlaps the first opening 61, which will be describedlater, in the direction x. At the surface 602, the light-shielding resin6 has a plurality of grooves 642 (not shown in FIG. 5). The grooves 642extend in one direction. In this embodiment, the grooves 642 extend inthe direction y. The surface 602 includes first groove surfaces 652 aand second groove surfaces 652 b. Each of the first groove surfaces andeach of the second groove surfaces define one of the grooves 642 andface each other across the bottom of the groove. In each of the grooves642, the first groove surface 652 a is on the direction x2 side, whereasthe second groove surface 652 b is on the direction x1 side. Both of thefirst groove surface 652 a and the second groove surface 652 b extendalong the direction y and are planar.

Each first groove surface 652 a is an inclined surface that proceedstoward the direction z2 side as proceeding toward the direction x1 side.The first groove surface 652 a is inclined at a first angle θ21 withrespect to the direction x. Each second groove surface 652 b is aninclined surface that proceeds toward the direction z2 side asproceeding toward the direction x2 side. The second groove surface 652 bis inclined at a second angle θ22 with respect to the direction x.Preferably, each of the first angle θ21 and the second angle θ22 is50-70°. In this embodiment, the first angle θ21 and the second angle θ22are the same.

As shown in FIGS. 1 and 2, the surface 603 of the first surface 6A is aportion that is on the direction x1 side of the first opening 61, whichwill be described later. Further, the surface 603 is on the direction x2side of the second opening 62, which will be described later. That is,the surface 603 is positioned between the first opening 61 and thesecond opening 62. At the surface 603, the light-shielding resin 6 has aplurality of grooves 643 (not shown in FIG. 5). The grooves 643 extendin one direction. In this embodiment, the grooves 643 extend in thedirection y. The surface 603 includes first groove surfaces 653 a andsecond groove surfaces 653 b. Each of the first groove surfaces and eachof the second groove surfaces define one of the grooves 643 and faceeach other across the bottom of the groove. In each of the grooves 643,the first groove surface 653 a is on the direction x2 side, whereas thesecond groove surface 653 b is on the direction x1 side. That is, ineach of the grooves 643, the second groove surface 653 b is further awayfrom the first opening 61 than the first groove surface 653 a is. Bothof the first groove surface 653 a and the second groove surface 653 bextend along the direction y and are planar.

Each first groove surface 653 a is an inclined surface that proceedstoward the direction z2 side as proceeding toward the direction x1 side.The first groove surface 653 a is inclined at a first angle θ31 withrespect to the direction x. Each second groove surface 653 b is aninclined surface that proceeds toward the direction z2 side asproceeding toward the direction x2 side. The second groove surface 653 bis inclined at a second angle 832 with respect to the direction x.Preferably, each of the first angle 831 and the second angle 832 is50-70°. In this embodiment, the first angle θ31 and the second angle θ32are the same.

As shown in FIGS. 1 and 2, the surface 604 of the first surface 6A is aportion that overlaps the second opening 62, which will be describedlater, in the direction x. At the surface 604, the light-shielding resin6 has a plurality of grooves 644 (not shown in FIG. 5). The grooves 644extend in one direction. In this embodiment, the grooves 644 extend inthe direction y. The surface 604 includes first groove surfaces 654 aand second groove surfaces 654 b. Each of the first groove surfaces andeach of the second groove surfaces define one of the grooves 644 andface each other across the bottom of the groove. In each of the grooves644, the first groove surface 654 a is on the direction x2 side, whereasthe second groove surface 654 b is on the direction x1 side. Both of thefirst groove surface 654 a and the second groove surface 654 b extendalong the direction y and are planar.

Each first groove surface 654 a is an inclined surface that proceedstoward the direction z2 side as proceeding toward the direction x1 side.The first groove surface 654 a is inclined at a first angle 641 withrespect to the direction x. Each second groove surface 654 b is aninclined surface that proceeds toward the direction z2 side asproceeding toward the direction x2 side. The second groove surface 654 bis inclined at a second angle θ42 with respect to the direction x.Preferably, each of the first angle 841 and the second angle 842 is50-70°. In this embodiment, the first angle 841 and the second angle 842are the same.

Unlike this embodiment, the surfaces 601-604 may not be theabove-described irregular surfaces, and all the surfaces 601-604 may beflat surfaces. Alternatively, of the first surface 6A, only the surface603 may be an irregular surface, whereas surfaces other than the surface603, i.e., the surfaces 601, 602 and 604 may be flat surfaces.

The second surface 6B faces the direction x1 side, whereas the secondsurface 6C faces the direction x2 side. At the second surface 6B, thelight-transmitting resin 5 is exposed. That is, the light-transmittingresin 5 has an exposed surface 5 b that is flush with the second surface6B. The third surface 6D faces the direction y2 side, whereas the thirdsurface 6E faces the direction y1 side. Except the first surface 6A, allthe paired second surfaces 6B, 6C and the paired third surfaces 6D, 6Eare flat surfaces.

As shown in FIGS. 1 and 2, the first opening 61 and the second opening62 are provided in the light-shielding resin 6. Both of the firstopening 61 and the second opening 62 are formed in the first surface 6A.The depth direction of the first opening 61 and the depth direction ofthe second opening 62 correspond to the direction z. For instance, thedepth of the first opening 61 and the second opening 62 is 0.42 mm. Forinstance, the maximum inner diameter of the first opening 61 is 1.3 mm.For instance, the maximum inner diameter of the second opening 62 alongthe direction y is 0.59 mm.

The light-transmitting resin 4 is exposed through the first opening 61.More specifically, the light-incident surface 41 and the flat surface 43of the light-transmitting resin 4 are exposed through the first opening61. The projection 40 of the light-transmitting resin 4 is received inthe first opening 61.

As shown in FIG. 5, the light-shielding resin 6 includes an innercircumferential wall 610 defining the first opening 61. As viewed in x-yplane, the inner circumferential wall 610 is generally circular. Theprojection 40 is spaced apart from the inner circumferential wall 610.The inner circumferential wall 610 is an inclined surface that proceedstoward the center of the first opening 61 as proceeding toward thedeeper side (direction z2 side) in the depth direction of the firstopening 61. The inclination angle of the inner circumferential wall 610with respect to the direction z becomes larger as proceeding furtheraway from the light-emitting element 2 in the direction x.

More specifically, as shown in FIGS. 6 and 7, the inner circumferentialwall 610 includes portions 610A, 610B and 610C. The portion 610A iscloser to the light-emitting element 2 than the portions 610B and 610Care. On the other hand, the 610C is further away from the light-emittingelement 2 than the portions 610A and 610B are. The portion 610A and theportion 610C face each other in the direction x. The portion 610B isbetween the portion 610A and the portion 610C in the direction x.

The portion 610A is a second portion. The inclination angle φ11 of theportion 610A with respect to the direction z is substantially 0°. In theportion between the portion 610A and the portion 610B, the inclinationangle with respect to the direction z gradually becomes larger asproceeding from the portion 610A toward the portion 610B. Theinclination angle φ12 of the portion 610B with respect to the directionz is larger than the inclination angle φ11. For instance, theinclination angle φ12 is 7.5°. In the portion between the portion 610Band the portion 610C, the inclination angle with respect to thedirection z gradually becomes larger as proceeding from the portion 610Btoward the portion 610C. The portion 610C is a first portion. Theinclination angle φ13 of the portion 610C with respect to the directionz is larger than both of the inclination angles φ11 and φ12. Forinstance, the inclination angle φ13 is 15°. The inclination angle φ13may be made larger than 15°, in accordance with the depth or innerdiameter of the first opening 61.

As shown in FIGS. 1-3, the inner circumferential wall 610 has an edge611 as a first edge. The edge 611 is circular. At the edge 611, theinner circumferential wall 610 and the first surface 6A are connected toeach other. In the depth direction (direction z) of the first opening61, the edge 611 is offset in the direction from the light-receivingelement 3 toward the light-incident surface 41 (direction z1) from anyportion of the light-transmitting resin 4 exposed through the firstopening 61.

The light-transmitting resin 5 is exposed through the second opening 62.More specifically, the light-emitting surface 51 and the flat surface 53of the light-transmitting resin 5 are exposed through the second opening62. The projection 50 of the light-transmitting resin 5 is received inthe second opening 62.

As shown in FIG. 5, the light-shielding resin 6 includes an innercircumferential wall 620 defining the second opening 62. The projection50 is spaced apart from the inner circumferential wall 620. The innercircumferential wall 620 is an inclined surface that proceeds toward thecenter of the second opening 62 as proceeding toward the deeper side(direction z2 side) in the depth direction of the second opening 62. Theinclination angle of the inner circumferential wall 620 with respect tothe depth direction is substantially constant throughout the entirecircumference.

The inner circumferential wall 620 includes portions 620A and 620B. Asviewed in x-y plane, the portion 610A is arcuate and along the outermostedge of the light-emitting surface 51. The portion 620B is flat andfaces the cut surface 52A. On the side further from the light-receivingelement 3 in the direction x, the inner circumferential wall 620 doesnot have a wall surface and is open. Thus, the cut surface 52B isexposed from the light-shielding resin 6 in the direction x1.

As shown in FIG. 1, the inner circumferential wall 620 has an edge 621as a second edge. Part of the edge 621 is circular. At the edge 621, theinner circumferential wall 620 and the first surface 6A are connected toeach other. In the depth direction (direction z) of the second opening62, the edge 621 is offset in the direction from the light-emittingelement 2 toward the light-emitting surface 51 (direction z1) from anyportion of the light-transmitting resin 5 exposed through the secondopening 62.

FIG. 10 is a plan view showing the state when the light-transmittingresins 4, 5 and the light-shielding resin are omitted from FIG. 5. Inthis figure, the light-transmitting resins 4 and 5 are indicated byimaginary lines. FIG. 11 is a bottom view of the optical apparatus 101.

The wiring pattern 8 shown in FIGS. 2, 10 and 11 includes alight-receiving element pad 811, a light-emitting element pad 812, aplurality of wire bonding pads 821, a plurality of through-holesurrounding portions 822, a first light-blocking portion 83, a secondlight-blocking portion 841, a third light-blocking portion 842, aconnecting portion 851, a connecting wiring 861, and mounting terminals88.

The light-receiving element pad 811, the light-emitting element pad 812,the wire bonding pads 821, the through-hole surrounding portions 822,the first light-blocking portion 83, the second light-blocking portion841, the third light-blocking portion 842, the connecting portion 851and the connecting wiring 861 are provided on the mount surface 10 ofthe substrate 1. The mounting terminals 88 are provided on the backsurface 11 of the substrate 1. That is, the mounting terminals 88 areprovided on a side of the substrate 1 which is opposite from the sidewhere the first light-blocking portion 83 is provided. For instance, thewiring pattern 8 is formed by electroplating. A resist layer (not shown)made of a resin may be provided on the wiring pattern 8.

On the light-receiving element pad 811 shown in FIG. 10 is mounted thelight-emitting element 3. On the light-emitting element pad 812 ismounted the light-emitting element 2. As viewed in plan, the area of thelight-emitting element pad 812 is smaller than that of thelight-receiving element pad 811.

A wire 78 or a wire 79 is bonded to each of the wire bonding pads 821.Each wire bonding pad 821 is generally rectangular as viewed in plan.Each through-hole surrounding portion 822 is connected to a wire bondingpad 821. Each through-hole surrounding portion 822 includes a generallycircular portion as viewed in plan.

FIG. 12 is a schematic enlarged sectional view taken along lines XII-XIIin FIG. 10.

The first light-blocking portion 83 shown in FIGS. 10 and 12 isinterposed between the light-shielding resin 6 and the substrate 1. Asshown in FIG. 10, as viewed in x-y plane, the first light-blockingportion 83 is positioned between the light-receiving element 2 and thelight-emitting element 3. The first light-blocking portion 83 extendsacross the light-emitting element 2 as viewed in the direction x. Thatis, the end of the first light-blocking portion 83 on the direction y1side is positioned on the direction y1 side of the light-emittingelement 2, and the end of the first light-blocking portion 83 on thedirection y2 side is positioned on the direction y2 side of thelight-emitting element 2. In this embodiment, the first light-blockingportion 83 extends along the direction y. However, the firstlight-blocking portion 83 may have a curved shape open toward thelight-emitting element pad 812 as viewed in x-y plane. The firstlight-blocking portion 83 has an opening 839. In this embodiment, theopening 839 is elongated in the direction y. Part of the light-shieldingresin 6 is received in the opening 839. The portion of thelight-shielding resin 6 which is received in the opening 839 is incontact with the substrate 1. This portion of the light-shielding resin6 which is received in the opening 839 is the bonding portion 609. Inother words, the light-shielding resin 6 includes the bonding portion609 bonded to the substrate 1. In FIG. 10, the bonding portion 609 isindicated by hatching.

The first light-blocking portion 83 includes a first portion 831, asecond portion 832 and joint portions 833, 834. The first portion 831and the second portion 832 are spaced apart from each other. In thisembodiment, the first portion 831 and the second portion 832 are spacedapart from each other in the direction x as viewed in x-y plane. Each ofthe first portion 831 and the second portion 832 is in the form of astrip elongated in the direction y. The first portion 831 and the secondportion 832 sandwich the bonding portion 609. The first portion 831(i.e., the first light-blocking portion 83) may include a portioncovered by the light-transmitting resin 5, as shown in FIG. 12. Unlikethis embodiment, the first light-blocking portion 83 may not be coveredby the light-transmitting resin 5. The joint portions 833 and 834 arespaced apart from each other, sandwiching the bonding portion 609between them. Each joint portion 833, 834 is connected to the firstportion 831 and the second portion 832. The first portion 831, thesecond portion 832 and the joint portions 833, 834 define the opening839.

FIG. 13 is a schematic enlarged sectional view taken along linesXIII-XIII in FIG. 10.

The second light-blocking portion 841 shown in FIGS. 10 and 13 isinterposed between the light-shielding resin 6 and the substrate 1. Inthis embodiment, the second light-blocking portion 841 is in the form ofa strip elongated in the direction x. In the direction x, the secondlight-blocking portion 841 overlaps the light-emitting element pad 812.The second light-blocking portion 841 is on the direction y2 side of thelight-emitting element pad 812. The second light-blocking portion 841may include a portion covered by the light-transmitting resin 5, asshown in FIG. 13. Unlike this embodiment, the second light-blockingportion 841 may not be covered by the light-transmitting resin 5.Preferably, the second light-blocking portion 841 is connected to thefirst light-blocking portion 83.

The third light-blocking portion 842 shown in FIGS. 10 and 13 isinterposed between the light-shielding resin 6 and the substrate 1. Inthis embodiment, the third light-blocking portion 842 is in the form ofa strip elongated in the direction x. In the direction x, the thirdlight-blocking portion 842 overlaps the light-emitting element pad 812.The third light-blocking portion 842 is on the direction y2 side of thelight-emitting element pad 812. Thus, the light-emitting element pad 812is between the third light-blocking portion 842 and the secondlight-blocking portion 841. The third light-blocking portion 842 mayinclude a portion covered by the light-transmitting resin 5, as shown inFIG. 13. Unlike this embodiment, the third light-blocking portion 842may not be covered by the light-transmitting resin 5. Preferably, thethird light-blocking portion 842 is connected to the firstlight-blocking portion 83.

In this embodiment, the third light-blocking portion 842 is electricallyconnected to the wire bonding pad 821 on which the wire 78 is bonded.Thus, the first light-blocking portion 83, which is connected to thethird light-blocking portion 842, is electrically connected to the wirebonding pad 821 on which the wire 78 is bonded. As noted before, thewire 78 is bonded to the cathode electrode 21 of the light-emittingelement 2. Thus, both of the third light-blocking portion 842 and thefirst light-blocking portion 83 are electrically connected to thecathode electrode 21 of the light-emitting element 2. The firstlight-blocking portion 83 may be a ground electrode in a circuitincluding the light-emitting element 2.

As shown in FIG. 10, the connecting portion 851 is connected to thelight-receiving element pad 811 and the first light-blocking portion 83.The connecting wiring 861 is connected to the wire bonding pad 821 onwhich the wire 79 bonded to the light-receiving element 3 is bonded, andto the through-hole surrounding portion 822. The connecting wiring 861is insulated from the first light-blocking portion 83 and extends acrossthe first light-blocking portion 83 in the direction x.

As shown in FIG. 11, each of the mounting terminals 88 is rectangular asviewed in x-y plane. Each mounting terminal 88 is electrically connectedto a through-hole surrounding portion 822, the light-receiving elementpad 811, the light-emitting element pad 812 or the like via athrough-hole electrode 89 (only one is shown in FIG. 2, not shown inother figures) penetrating the substrate 1.

A method for making the optical apparatus 101 is briefly explainedbelow.

FIG. 14 is a plan view showing a step in a process of making the opticalapparatus 101. First, as shown in FIG. 14, a substrate 1 is prepared. Awiring pattern 8 is formed on the substrate 1. Then, as shown in thefigure, a light-emitting element 2 and a light-receiving element 3 areplaced on the substrate 1. Then, a wire 78 is bonded to thelight-emitting element 2 and wiring pattern 8, and wires 79 are bondedto the light-receiving elements 3 and the wiring pattern 8.

FIG. 15 is a plan view showing a step subsequent to FIG. 14. FIG. 16 isa schematic enlarged sectional view taken along lines XVI-XVI in FIG.15. FIG. 17 is a schematic enlarged sectional view taken along linesXVII-XVII in FIG. 15. Then, a molding step for forming thelight-transmitting resins 4 and 5 is performed. This molding step isreferred to as a primary resin molding step. In the primary resinmolding step, a mold 701 is first pressed against the substrate 1, asshown in FIGS. 16 and 17. The mold 701 has a flat surface 702 facing themount surface 10 of the substrate 1. In FIG. 15, the region of thesubstrate 1 which overlaps the flat surface 702 is indicated byhatching. In pressing the mold 701 against the substrate 1, the flatsurface 702 is brought into contact with the first light-blockingportion 83. In this process, as shown in FIG. 16, the opening 839 formedin the first light-blocking portion 83 is closed by the flat surface702. Similarly, as shown in FIG. 17, in pressing the mold 701 againstthe substrate 1, the flat surface 702 is brought into contact with thesecond light-blocking portion 841 and the third light-blocking portion842.

FIG. 18 is a plan view showing a step subsequent to FIG. 15. FIG. 19 isa schematic enlarged sectional view taken along lines XIX-XIX in FIG.18. FIG. 20 is a schematic enlarged sectional view taken along linesXX-XX in FIG. 18. Then, as shown in FIGS. 19 and 20, a resin material isintroduced into the space enclosed by the substrate 1 and the mold 701,and then the resin material is hardened. By this process, thelight-transmitting resin 4 covering the light-receiving element 3 andthe light-transmitting resin 5 covering the light-emitting element 2 areformed. As shown in FIG. 19, in introducing a resin material into thespace enclosed by the substrate 1 and the mold 701, the resin does notenter the opening 839 because the opening 839 is closed by the flatsurface 702. Thus, the light-transmitting resin is not formed in theopening 839. In FIG. 18, the region of the substrate 1 on which thelight-transmitting resin 4, 5 is formed is indicated by hatching.

Then, a light-shielding resin 6 to cover the light-transmitting resins4, 5 and the substrate 1 is formed by a molding step. This molding stepis referred to as a secondary rein molding step. By the secondary resinmolding step, as shown in FIGS. 12 and 13, the light-shielding resin 6that covers the first light-blocking portion 83, the secondlight-blocking portion 841 and the third light-blocking portion 842 areformed. Further, since the light-transmitting resin 5 is not formed inthe opening 839 as shown in FIG. 19, the light-shielding resin 6 isformed also in the opening 839 as shown in FIG. 12. Thus, the bondingportion 609 for bonding to the substrate 1 is formed in thelight-shielding resin 6.

As shown in FIG. 21, a mold 7 is used in the secondary resin moldingstep. The mold 7 includes a cylindrical portion 70 corresponding to theshape of the first opening 61 and a cylindrical portion 70 correspondingto the shape of the second opening 62. In FIG. 21, only the cylindricalportion 70 corresponding to the first opening 61 is shown. Thecylindrical portion 70 is arranged around the projection 40 or theprojection 50 and removed from the light-shielding resin 6 after theresin is hardened. Thus, the inner circumferential wall 610 of theopening 61 is formed without the contact of the cylindrical portion 70with the projection 40. This prevents the resin material for forming thelight-shielding resin 6 from adhering to the light-incident surface 41.Similarly, the inner circumferential wall 620 of the second opening 62is formed without the contact of the cylindrical portion 70 with theprojection 50. This prevents the resin material for forming thelight-shielding resin 6 from adhering to the light-emitting surface 51.In order for the cylindrical portion 70 to be easily removed from thelight-shielding resin 6, the inner circumferential wall 610 is made aninclined surface that proceeds toward the center of the first opening 61as proceeding deeper (direction z2 side) in the depth direction of thefirst opening 61. This holds true for the inner circumferential wall620.

The use of the electronic device 801 is described below.

As shown in FIGS. 22 and 23, the infrared light L11 emitted from thelight-emitting element 2 travels through the light-emitting surface 51toward the light-transmitting cover 803. The infrared light L11 passesthrough the light-transmitting cover 803. When there is an object 891close to the light-transmitting cover 803 as shown in the figure, theinfrared light L11 passing through the light-transmitting cover 803 isreflected by the object 891 and then travels again toward thelight-transmitting cover 803. The infrared light L11 reflected by theobject 891 passes through the light-transmitting cover 803 and thelight-incident surface 41 and is then received by the infrared lightdetecting portion 32 of the light-receiving element 3. The functionalelement portion 33 of the light-receiving element 3 outputs to theoutside the above-described proximity signal indicating that there is anobject 891 close to light-transmitting cover 803. When the functionalelement portion 33 outputs to the outside a proximity signal during theemission of infrared light L11 from the light-emitting element 2, itindicates that the optical apparatus 101 has detected the object 891close to the light-transmitting cover 803. On the other hand, when thereis no object close to the light-transmitting cover 803, the infraredlight L11 emitted from the light-emitting element 2 and passing throughthe light-transmitting cover 803 continues to travel in the directionz1. Thus, the infrared light L11 emitted from the light-emitting element2 is not received by the infrared light detecting portion 32 of thelight-receiving element 3. In this case, the functional element portion33 of the light-receiving element 3 does not output the above-describedproximity signal to the outside. When the functional element portion 33does not output a proximity signal during the emission of infrared lightL11 from the light-emitting element 2, it indicates that the opticalapparatus 101 has not detected any object 891 close to thelight-transmitting cover 803. In this way, the optical apparatus 101detects presence or absence of the object 891 close to thelight-transmitting cover 803. Although the travel direction of theinfrared light L11 shown in FIG. 22 is not along the direction z, thetravel direction of the infrared light L11 passing through thelight-emitting surface 51, reflected by the object 891 and received bythe light-receiving element 3 actually extends substantially along thedirection z.

The advantages of this embodiment are described below.

As shown in FIGS. 10 and 12, in the optical apparatus 101, the wiringpattern 8 has the first light-blocking portion 83. The firstlight-blocking portion 83 is interposed between the light-shieldingresin 6 and the substrate 1, and also between the light-emitting element2 and the light-receiving element 3 as viewed in x-y plane. The firstlight-blocking portion 83 extends across the light-emitting element 2 inthe direction y. With this arrangement, between the light-emittingelement 2 and the light-receiving element 3, the first light-blockingportion 83 blocks the travel path of the light from thelight-transmitting resin 5 to the light-transmitting resin 4 through agap between the light-shielding resin 6 and the substrate 1. Thus,between the light-emitting element 2 and the light-receiving element 3,the light emitted from the light light-emitting element 2 is preventedfrom traveling from the light-transmitting resin 5 to thelight-transmitting resin 4 by passing through a gap between thelight-shielding resin 6 and the substrate 1. Thus, the light emittedfrom the light-emitting element 2 is prevented from passing through agap between the light-shielding resin 6 and the substrate 1 to bereceived by the light-receiving element 3. This reduces false detectionsuch as determining an object 891 to exist close to thelight-transmitting cover 803, though the object 891 actually does notexist close to the light-transmitting cover.

As shown in FIGS. 10 and 12, in the optical apparatus 101, the firstlight-blocking portion 83 has the first portion 831 and the secondportion 832 which are spaced apart from each other. The light-shieldingresin 6 has the bonding portion 609 sandwiched between the first portion831 and the second portion 832 and in contact with the substrate 1. Inthis arrangement, the bonding strength between the material forming thebonding portion 609, which is part of the light-shielding resin 6, andthe material forming the substrate 1 is generally larger than thebonding strength between the material forming the light-shielding resin6 and the material forming the wiring pattern 8. Also, even in the casewhere a resist layer (not shown) is provided on the wiring pattern 8,the bonding strength between the material forming the bonding portion609 and the material forming the substrate 1 is generally larger thanthe bonding strength between the material forming the bonding portion609 and the material forming the resist layer. Thus, the arrangementthat the light-shielding resin 6 has the bonding portion 609 in contactwith the substrate 1 is suitable for reliably bonding thelight-shielding resin 6 to the substrate 1. Thus, the optical apparatus101 reliably prevents the light-shielding resin 6 from being detachedfrom the substrate 1.

As shown in FIGS. 10 and 13, in the optical apparatus 101, the wiringpattern 8 has the second light-blocking portion 841 interposed betweenthe light-shielding resin 6 and the substrate 1. The secondlight-blocking portion 841 overlaps the light-emitting element pad 812in the direction x. With this arrangement, even when the light emittedfrom the light-emitting element 2 travels within the light-transmittingresin 5 toward the direction y2 side of the light-emitting element pad812, the second light-blocking portion 841 prevents the light frompassing through a gap between the light-shielding resin 6 and thesubstrate 1. Thus, even when the light from the light-emitting element 2travels toward the direction y2 side of the light-emitting element pad812 within the light-transmitting resin 5, the light from thelight-emitting element 2 is prevented from traveling from thelight-transmitting resin 5 to the light-transmitting resin 4 by passingthrough a gap between the light-shielding resin 6 and the substrate 1.Thus, the light emitted from the light-emitting element 2 is preventedfrom passing through a gap between the light-shielding resin 6 and thesubstrate 1 to be received by the light-receiving element 3. Thisreduces false detection such as determining an object 891 to exist closeto the light-transmitting cover 803, though the object 891 actually doesnot exist close to the light-transmitting cover.

In the optical apparatus 101, the second light-blocking portion 841 isconnected to the first light-blocking portion 83. This arrangementeliminates the gap between the second light-blocking portion 841 and thefirst light-blocking portion 83. Thus, between the second light-blockingportion 841 and the first light-blocking portion 83, the light from thelight-emitting element 2 is prevented from traveling from thelight-transmitting resin 5 to the light-transmitting resin 4 by passingthrough a gap between the light-shielding resin 6 and the substrate 1.Thus, the light emitted from the light-emitting element 2 is preventedfrom passing through a gap between the light-shielding resin 6 and thesubstrate 1 to be received by the light-receiving element 3. Thisfurther reduces the above-described false detection.

As shown in FIGS. 10 and 13, in the optical apparatus 101, the wiringpattern 8 has the third light-blocking portion 842 interposed betweenthe light-shielding resin 6 and the substrate 1. The thirdlight-blocking portion 842 overlaps the light-emitting element pad 812in the direction x. In the direction y, the light-emitting element pad812 is positioned between the second light-blocking portion 841 and thethird light-blocking portion 842. This further reduces the falsedetection for the same reason as described above with respect to thesecond light-blocking portion 841.

In the optical apparatus 101, the third light-blocking portion 842 isconnected to the first light-blocking portion 83. This reduces the falsedetection for the same reason as described above with respect to thesecond light-blocking portion 841.

In the optical apparatus 101, the first light-blocking portion 83, whichtends to have a relatively large area as viewed in x-y plane, canfunction as an antenna. When the first light-blocking portion 83functions as an antenna, the circuit including the light-emittingelement 2, for example, may malfunction. Thus, it is preferable that thefirst light-blocking portion 83 is a ground electrode. When the firstlight-blocking portion 83 is a ground electrode, the potential of thefirst light-blocking portion 83 is constant even when the firstlight-blocking portion 83 functions as an antenna. This reducesmalfunction of the circuit including the light-emitting element 2.

In the optical apparatus 101, some part of the infrared light L11exiting the light-emitting surface 51 impinges on the light-transmittingcover 803 with a relatively large incident angle. As shown in FIGS. 22and 23, the part of the infrared light L11 which impinges on thelight-transmitting cover 803 with a relatively large incident angle doesnot pass through the light-transmitting cover 803 but is reflected bythe inner surface of the light-transmitting cover 803 to become noiselight L12. Part of the noise light L12 travels toward the first surface6A or the first opening 61 while forming a relatively large angle withrespect to the direction z. In the optical apparatus 101, in the depthdirection (direction z) of the first opening 61, the edge 611 of theinner circumferential wall 610 is offset in the direction from thelight-receiving element 3 toward the light-incident surface 41(direction z1) from any portion of the light-transmitting resin 4exposed through the first opening 61. Thus, the light-shielding resin 6blocks part of the noise light L12 that travels while forming arelatively large angle with respect to the direction z before the lightreaches the light-incident surface 41. This reduces the amount of noiselight L12 that passes through the light-incident surface 41 to reach thelight-receiving element 3. Reducing the amount of the noise light L12reaching the light-receiving element 3 reduces false detection such asdetermining an object 891 to exist close to the light-transmitting cover803, though the object 891 actually does not exist close to thelight-transmitting cover.

In the optical apparatus 101, the inner circumferential wall 610 hasportions 610A and 610C that face each other in the direction (directionx) perpendicular to the depth direction (direction z) of the firstopening 61. The inclination angle φ13 of the portion 610C with respectto the depth direction of the first opening 61 (direction z) is largerthan the inclination angle φ11 of the portion 610A with respect to thedepth direction of the first opening 61 (direction z). As shown in FIG.23, part of the noise light L12 enters the first opening 61. The part ofthe light entering the first opening 61 is reflected by the portion610C. As the inclination angle φ13 is larger than the inclination angleφ11, the noise light L12 reflected by the portion 610C does not traveltoward the light-emitting surface 41 but travels toward the portion610A. Thus, the amount of the noise light L12 that reaches thelight-emitting surface 41 after being reflected by the portion 610Creduces. Accordingly, the amount of the noise light L12 that reaches thelight-receiving element 3 reduces, which leads to further reduction offalse detection.

FIG. 25 is a graph obtained by simulation, showing the amount of thenoise light L12 received by the light-receiving element 3 with respectto the inclination angle φ13 of the portion 610C of the innercircumferential wall 610. In this graph, the output level of thelight-receiving element 3 when the inclination angle φ13 is 0° isdetermined to be “100%” as a reference level. As will be understood fromthe graph, the amount of the noise light L12 reduces to the lower limitlevel when the inclination angle φ13 is 15° or larger.

In the optical apparatus 101, the light-incident surface 41 is flat.With this arrangement, the amount of the noise light L12 that impingeson the light-emitting surface 41 after being reflected by the portion610C is smaller than the case where the light-incident surface 41 isconvex.

In the optical apparatus 101, in the depth direction (direction z) ofthe second opening 62, the edge 621 of the inner circumferential wall620 is offset in the direction from the light-emitting element 3 towardthe light-emitting surface 51 (direction z1) from any portion of thelight-transmitting resin 5 exposed through the second opening 62. Withthis arrangement, the light traveling from the light-emitting surface 51in a direction that forms a large incident angle to thelight-transmitting cover 803 is easily blocked by the innercircumferential wall 620. This reduces the amount of noise light L12received by the light-receiving element 3, which leads to reduction offalse detection.

In the optical apparatus 101, the cut surface 52B is exposed from thelight-shielding resin 6 in the direction x1. With this arrangement, theinfrared light L11 is emitted from the cut surface 52B as well. Theinfrared light L11 emitted from the cut surface 52B travels in thedirection x1 without being blocked by the inner circumferential wall620. This also reduces the amount of noise light L12 received by thelight-receiving element 3, which leads to reduction of false detection.

In the optical apparatus 101, the light-shielding resin 6 has thesurface 603. The surface 603 is irregular, faces the direction z1, andis positioned on the direction x1 side of the first opening 61. Thesurface 603, which is irregular, can be arranged in such a manner thatthe noise light L12 reflected by the surface 603 does not travel towardthe first opening 61. Thus, the amount of the noise light L12 thattravels toward the first opening 61 can be reduced. In particular, inthe optical apparatus 101, the light-shielding resin 6 has a pluralityof grooves 643 elongated in one direction on the surface 603. Thesurface 603 includes first groove surfaces 653 a and second groovesurfaces 653 b. Each of the first groove surfaces and each of the secondgroove surfaces define one of the grooves 643 and face each other acrossthe bottom of the groove. In each of the grooves 643, the second groovesurface 653 b is further away from the first opening 61 than the firstgroove surface 653 a is. According to this arrangement, part of thenoise light L12 is reflected by the first groove surface 653 a to traveltoward the side opposite from the first opening 61. Thus, the amount ofthe noise light L12 traveling toward the first opening 61 reduces.Unlike this embodiment, the surface 603 may be made irregular by formingminute irregularities on the surface 603.

FIG. 24 is a graph obtained by simulation, showing the amount of thenoise light L12 received by the light-receiving element 3, depending onthe inclination angle θ31, with respect to the distance d between theoptical apparatus 101 and the light-transmitting cover 803. In thisgraph, the output level of the light-receiving element 3 when theinclination angle θ31 is 0° is determined to be “1” as a referencelevel. As will be understood from the graph, when the inclination angleθ31 is 50°, 60° or 70°, the amount of the noise light L12 received bythe light-receiving element 3 is effectively reduced even when thedistance d changes in the range of from 0.25 to 1 mm.

In the optical apparatus 101, the light-receiving element 3 has thesemiconductor substrate 30, the visible light detecting portion 31 andthe infrared light detecting portion 32. The visible light detectingportion 31 and the infrared light detecting portion 32 are provided onthe same semiconductor substrate 30. According to this structure, asingle-chip light-receiving element 3 having the visible light detectingfunction and the infrared light detecting function is provided. Thisarrangement achieves size reduction of the light-receiving element 3, ascompared with the case where each of the visible light detectingfunction and the infrared light detecting function is realized by anindividual chip. Size reduction of the light-receiving element 3contributes to size reduction of the optical apparatus 101. In thestructure including a single-chip light-receiving element 3 having thevisible light detecting function and the infrared light detectingfunction, both of the light to reach the visible light detecting portion31 and the light to reach the infrared light detecting portion 32 passthrough the light-incident surface 41. Thus, it is not necessary toprovide a light-incident surface for the light to reach the infraredlight detecting portion 32, separately from the light-incident surfacefor the light to reach the visible light detecting portion 31. This alsocontributes to size reduction of the optical apparatus 101.

In the optical apparatus 101, the light-receiving element 3 has themulti-layered optical film 34 that covers the infrared light detectingportion 32 and transmits the infrared light. With this structure, inmolding the light-transmitting resin 4 on the light-receiving element 3,an individual resin molding step is not necessary for each of thevisible light detecting portion 31 and the infrared light detectingportion 32. Moreover, the multi-layered optical film 34 is formed in asemiconductor process for forming a thin film on the semiconductorsubstrate 30. Thus, an additional process for forming the multi-layeredoptical film 34 is not necessary, and semiconductor manufacturingequipment can be used. Thus, the manufacturing cost reduces.

A variation of the first embodiment is described below with reference toFIG. 26. In the variation below, the elements that are identical orsimilar to those of the foregoing optical apparatus 101 are designatedby the same reference signs as those used for the foregoing opticalapparatus, and the description is omitted.

This figure is a plan view showing a variation of the optical apparatusaccording to the first embodiment. The optical apparatus of thisvariation differs from the optical apparatus 101 in that the wiringpattern 8 includes a third light-blocking portion 843 instead of thelight-blocking portion 842, the wiring pattern includes a linkingportion 852, the cathode electrode 21 is bonded on the light-emittingelement pad 812, and a wire 78 is bonded on the anode electrode 22.Other structures are the same.

In this variation, unlike the third light-blocking portion 842 of theoptical apparatus 101, the third light-blocking portion 843 is notelectrically connected to the wire bonding pad 821 on which the wire 78is bonded. Specifically, the third light-blocking portion 843 isinterposed between the light-shielding resin 6 and the substrate 1. Inthis variation, the third light-blocking portion 843 is in the form of astrip elongated in the direction x. The third light-blocking portion 843overlaps the light-emitting element pad 812 in the direction x. Thethird light-blocking portion 843 is on the direction y2 side of thelight-emitting element pad 812. Thus, the light-emitting element pad 812is positioned between the third light-blocking portion 843 and thesecond light-blocking portion 841. Similarly to the third light-blockingportion 842, the third light-blocking portion 843 may include a portioncovered by the light-transmitting resin 5, or the third light-blockingportion 843 may not be covered by the light-transmitting resin 5.Preferably, the third light-blocking portion 843 is connected to thefirst light-blocking portion 83.

The linking portion 852 is connected to the light-emitting element pad812 and the first light-blocking portion 83. In this variation, thelinking portion 852 is in the form of a strip elongated in the directionx. However, the shape of the linking portion 852 is not limited to this.The linking portion 852 is positioned between the light-emitting elementpad 812 and the first light-blocking portion 83 and covered by thelight-transmitting resin 5.

As noted before, the cathode electrode 21 is bonded to thelight-emitting element pad 812. Thus, both of the linking portion 852and the first light-blocking portion 83 are electrically connected tothe cathode electrode 21 of the light-emitting element 2. In thisvariation again, the first light-blocking portion 83 may be a groundelectrode in a circuit including the light-emitting element 2.

With this structure again, the same advantages as those of the opticalapparatus 101 are obtained.

The above-described structure of the wiring pattern 8 may be applied tothe optical apparatus according to the second through the sixthembodiments.

A second through a ninth embodiments are described below. In theembodiments below, the elements that are identical or similar to thoseof the first embodiment are designated by the same reference signs asthose used for the first embodiment, and the description is omitted.

<Second Embodiment>

FIG. 27 is a sectional view of an optical apparatus according to asecond embodiment.

The optical apparatus 102 shown in the figure is different from theforegoing optical apparatus 101 in that each of the grooves 641-644 hasa rectangular cross section. Except the cross sectional shape of thegrooves 641-644, the structure of the optical apparatus 102 is the sameas that of the optical apparatus 101, so that the description isomitted. With this structure again, similarly to the first embodiment,the first groove surface 653 a reflects part of the noise light L12 tocause the noise light to travel toward the side opposite from the firstopening 61. Thus, the noise light L12 traveling toward the first opening61 reduces.

<Third Embodiment>

FIG. 28 is a sectional view of an optical apparatus according to a thirdembodiment.

The optical apparatus 103 shown in the figure is different from theoptical apparatus 101 in cross sectional shape of the grooves 641-644.That is, at the surface 601 of the optical apparatus 103, the firstangle θ11 that is the inclination angle of each groove surface 651 awith respect to the direction x is smaller than the second angle θ12that is the inclination angle of each groove surface 651 b with respectto the direction x. At the surface 603 of the optical apparatus 103, thefirst angle θ31 that is the inclination angle of each groove surface 653a with respect to the direction x is larger than the second angle 832that is the inclination angle of each groove surface 653 b with respectto the direction x. The inclination angle θ21 and the inclination angleθ22 are the same. Similarly, the inclination angle θ41 and theinclination angle θ42 are the same.

According to this structure, at the surface 603, the first angle θ31 islarger than the second angle θ32. This arrangement reduces the amount ofnoise light L12 that is reflected by the first groove surface 653 a andthen impinges on the second groove surface 653 b, and reliably causesthe light reflected by the first groove surface 653 a to travel towardthe side opposite from the first opening 61. This arrangement issuitable for reducing the amount of noise light L12 traveling toward thefirst opening 61.

Moreover, at the surface 601, the first angle θ11 is smaller than thesecond angle θ12. According to this structure, the noise light L12traveling from between the surface 603 and the light-transmitting cover803 to the space between the surface 601 and the light-transmittingcover 803 is reliably reflected by the first groove surface 651 a sothat the noise light travels toward the direction x2 side. Thisarrangement is suitable for reducing the amount of noise light L12traveling toward the first opening 61.

<Fourth Embodiment>

FIG. 29 is a plan view of an optical apparatus according to a fourthembodiment. FIG. 30 is a sectional view taken along lines XXX-XXX inFIG. 29.

In the optical apparatus 104 shown in the figure, a plurality of grooves646 are provided on the surfaces 601-603 of the first surface 6A of thelight-shielding resin 6. Each groove 646 extends in the same direction.In this embodiment, each groove 646 extends circumferentially around thecenter of the first opening 61. The surfaces 601-603 include firstgroove surfaces 656 a and second groove surfaces 656 b. Each of thefirst groove surfaces and each of the second groove surfaces define oneof the grooves 646 and face each other across the bottom of the groove646. At the center of the surface 603 in the direction y, the firstgroove surface 656 a of each groove 646 is positioned on the directionx2 side, whereas the second groove surface 656 b is positioned on thedirection x1 side. That is, at the center of the surface 603 in thedirection y, the second groove surface 656 b of each groove 646 isfurther away from the first opening 61 than the first groove surface 656a is. The first groove surface 656 a and the second groove surface 656 bat the center of the surface 603 in the direction y are described below.

Each first groove surface 656 a is an inclined surface that proceedstoward the direction z2 side as proceeding toward the direction x1 side.The first groove surface 656 a is inclined at a first angle 861 withrespect to the direction x. Each second groove surface 656 b is aninclined surface that proceeds toward the direction z2 side asproceeding toward the direction x2 side. The second groove surface 656 bis inclined at a second angle θ62 with respect to the direction x.Preferably, each of the first angle θ61 and the second angle θ62 is50-70°. In this embodiment, the first angle θ61 and the second angle θ62are the same. However, as in the third embodiment, the first angle θ61may be larger than the second angle θ62.

With this arrangement again, the first groove surface 656 a reflectspart of the noise light L12 to cause the noise light to travel towardthe side opposite from the first opening 61. Thus, the noise light L12traveling toward the first opening 61 reduces.

<Fifth Embodiment>

FIG. 31 is a plan view of an optical apparatus according to a fifthembodiment. FIG. 32 is a sectional view taken along lines XXXII-XXXII inFIG. 31.

In the optical apparatus 105 shown in the figures, a plurality ofgrooves 647 are provided on the surface 603 of the first surface 6A ofthe light-shielding resin 6. The grooves 647 extend in one direction. InFIG. 31, the region having the grooves 647 is indicated by hatching forconvenience. In this embodiment, each groove 647 extends in thedirection x. The surface 603 includes first groove surfaces 657 a andsecond groove surfaces 657 b. Each of the first groove surfaces and eachof the second groove surfaces define one of the grooves 647 and faceeach other across the bottom of the groove 647. In each groove 647, thesecond groove surface 657 b is further away from the imaginary straightline L15 extending through the center of the first opening 610 in thedirection x than the first groove surface 657 a is.

Each first groove surface 657 a is an inclined surface that proceedstoward the direction z2 side as proceeding away from the imaginary L15in the direction y. The first groove surface 657 a is inclined at afirst angle θ71 with respect to the direction y. Each second groovesurface 657 b is an inclined surface that proceeds toward the directionz2 side as proceeding toward the imaginary line L15 in the direction y.The second groove surface 657 b is inclined at a second angle θ72 withrespect to the direction y. Preferably, each of the first angle θ71 andthe second angle θ72 is 50-70°. In this embodiment, the first angle θ71is larger than the second angle θ72.

With this structure, the noise light L12 reflected by the first groovesurface 657 a travels to proceed away from the imaginary straight lineL15 as viewed in x-y plane. Thus, the noise light L12 traveling towardthe first opening 61 reduces.

<Sixth Embodiment>

FIG. 33 is a perspective view of an optical apparatus according to asixth embodiment. FIG. 34 is a sectional view taken along linesXXXIV-XXXIV in FIG. 33.

The optical apparatus 106 shown in the figure differs from the foregoingoptical apparatus 101 in that the light-transmitting resin 5 is notexposed from the light-shielding resin 6 in the direction x1. The firstsurface 6A of the light-shielding resin 6 includes a surface 605positioned on the direction x1 side of the second opening 62. In thisembodiment, the surface 605 has a plurality of grooves 645. Unlike thisembodiment, the surface 605 may not have grooves and may be a flatsurface. This structure provides substantially the same advantages asthose of the optical apparatus 101.

<Seventh Embodiment>

FIG. 35 is a plan view showing a light-receiving element of an opticalapparatus according to a seventh embodiment.

As shown in the figure, in the light-receiving element 3, the entiretyof the visible light detecting portion 31 is positioned outside thesmallest rectangular region S11 enclosing the infrared light detectingportion 32 as viewed in x-y plane. Moreover, as viewed in x-y plane, theinfrared light detecting portion 32 is positioned further away from thelight-emitting element 2 than the visible light detecting portion 31 is.This structure provides the same advantages as those of the opticalapparatus 101.

<Eighth Embodiment>

FIG. 36 is a sectional view of an optical apparatus according to aneighth embodiment.

The optical apparatus 108 shown in the figure differs from the opticalapparatus 101 in that the light-receiving element 3 comprises aphotodiode that does not include a visible light detecting portion. Theoptical apparatus 108 includes a substrate 1, a light-emitting element2, a light-receiving element 3, an illuminance sensor element 3′,light-transmitting resins 4, 5, 999 and a light-shielding resin 6. Sincethe structures of the substrate 1, the light-emitting element 2, thelight-transmitting resins 4, 5 and the light-shielding resin 6 aresubstantially the same as those of the optical apparatus 101,description of these is omitted. The illuminance sensor element 3′ hasthe same function as that of the visible light detecting portion 31 ofthe light-receiving element 3 of the optical apparatus 101. Thelight-transmitting resin 999 covers the illuminance sensor element 3′and is exposed from the light-shielding resin 6. Visible light impingeson the illuminance sensor element 3′ through a portion of thelight-transmitting resin 999 which is exposed from the light-shieldingresin 6. This arrangement also reduces the noise light L12 that travelstoward the first opening 61.

Ninth Embodiment

FIG. 37 is a sectional view of an electronic device according to a ninthembodiment.

The electronic device 808 shown in the figure is different from theabove-described electronic device 801 in that the optical apparatus 109does not include the light-emitting element 2 and the light-transmittingresin 5. Since the other parts are the same as those of the opticalapparatus 101, the description is omitted. For instance, the opticalapparatus 109 can be used along with a light-emitting device 301including a light-emitting element 2 and separate from the opticalapparatus 109, to function as a proximity sensor. This arrangement alsoreduces the noise light L12 that travels toward the first opening 61.

The scope of the present invention is not limited to the foregoingembodiments. The specific structure of each part of the presentinvention can be varied in design in many ways.

The invention claimed is:
 1. An optical apparatus comprising: asubstrate; a wiring pattern formed on the substrate; a light-receivingelement and a light-emitting element provided on the substrate andspaced apart from each other in a first direction perpendicular to athickness direction of the substrate; a first light-transmitting resincovering the light-receiving element; a second light-transmitting resincovering the light-emitting element; and a light-shielding resincovering the first light-transmitting resin and the secondlight-transmitting resin; wherein the wiring pattern includes a firstlight-blocking portion interposed between the light-shielding resin andthe substrate and positioned between the light-receiving element and thelight-emitting element as viewed in the thickness direction, the firstlight-blocking portion includes a first portion and a second portionspaced apart from each other, the light-shielding resin includes abonding portion that is sandwiched between the first portion and thesecond portion and in contact with the substrate, the firstlight-blocking portion includes two joint portions spaced apart fromeach other as viewed in the thickness direction, with the bondingportion positioned therebetween, and each of the joint portions isconnected to both of the first portion and the second portion.
 2. Theoptical apparatus according to claim 1, wherein the first light-blockingportion extends across the light-emitting element as viewed in the firstdirection.
 3. The optical apparatus according to claim 1, wherein thebonding, portion overlaps the light-emitting element in a seconddirection perpendicular to both of the thickness direction and the firstdirection.
 4. The optical apparatus according to claim 1, wherein eachof the first portion and the second portion is in a form of a stripelongated in a second direction perpendicular to both of the thicknessdirection and the first direction.
 5. The optical apparatus according toclaim 1, wherein the wiring pattern includes a light-emitting. elementpad on which the light-emitting element is bonded.
 6. The opticalapparatus according to claim 5, wherein the wiring pattern includes asecond light-blocking portion interposed between the light-shieldingresin and the substrate, and the second light-blocking portion overlapsthe light-emitting element pad in the first direction.
 7. The opticalapparatus according to claim 6, wherein the second light-blockingportion includes a portion covered by the second light-transmittingresin.
 8. The optical apparatus according to claim 6, wherein the secondlight-blocking portion is connected to the first light-blocking portion.9. The optical apparatus according to claim 6, wherein the wiringpattern includes a third light-blocking portion interposed between thelight-shielding resin and the substrate, the third light-blockingportion overlaps the light-emitting element pad in the first direction,and the light-emitting element pad is positioned between the secondlight-blocking portion and the third light-blocking portion as viewed inthe first direction.
 10. The optical apparatus according to claim 9,wherein the third light-blocking portion includes a portion covered bythe second light-transmitting resin.
 11. The optical apparatus accordingto claim 9, wherein the third light-blocking portion is connected to thefirst light-blocking portion.
 12. The optical apparatus according toclaim 9, further comprising a wire bonded to the light-emitting element,wherein the wiring pattern includes a wire bonding pad on which the wireis bonded, and the third light-blocking portion is electricallyconnected to the wire bonding pad.
 13. The optical apparatus accordingto claim 5, further comprising a wire bonded to the light-emittingelement, wherein the wiring pattern includes a wire bonding pad on whichthe wire is bonded, and a linking portion connected to thelight-emitting element pad and the first light-blocking portion.
 14. Theoptical apparatus according to claim 1, wherein the light-emittingelement includes a cathode electrode and an anode electrode, and thefirst light-blocking portion is electrically connected to the cathodeelectrode.
 15. The optical apparatus according to claim 1, wherein thefirst light-blocking blocking portion is a ground electrode.
 16. Theoptical apparatus according to claim 1, wherein the wiring patternincludes a light-receiving element pad on which the light-receivingelement is arranged, and a connecting portion connected to thelight-receiving element pad and the first light-blocking portion. 17.The optical apparatus according to claim 1, wherein the firstlight-blocking portion includes a portion covered by the secondlight-transmitting resin.
 18. The optical apparatus according to claim1, wherein the wiring pattern includes a mounting terminal on a side ofthe substrate which is opposite from a side where the firstlight-blocking portion is provided.
 19. The optical apparatus accordingto claim 18, further comprising a through-hole electrode electricallyconnected to the mounting terminal and penetrating the substrate. 20.The optical apparatus according to claim 1, wherein the firstlight-blocking portion is formed with an opening defined by the firstportion, the second portion and the two joint portions, the openingextends through the first light-blocking portion in the thicknessdirection, and the opening has an open end an entirety of which isclosed by the substrate.